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Flexible Electronics Research

North Carolina Agricultural and Technical State University




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Organic materials development:

           The MCNC R&D facility is housed in 3000 square feet of Class 1000.  A support staff of process engineers and technicians maintains this facility for novel materials and device development.  The primary facilities utilized by the CENTER involve the deposition, processing, and characterization of organic semiconductors thin films.  The deposition system for organic materials and OLED device fabrication consists of two deposition chambers connected by a load-lock.  One deposition chamber is used for thermal evaporation of organic small molecule compounds.  The other chamber is used for thermal evaporation, electron beam evaporation, and sputtering of inorganic thin films.  The load lock provides plasma cleaning of substrates.  Flexible or rigid substrates up to 150mm diameter or 100 mm x 100 mm square may be processed.  The load lock is connected to an inert gas glove box to permit encapsulation of organic devices that are sensitive to environmental exposure

            In addition to organic semiconductor processing, the facility offers a full suite of semiconductor processing and microfabrication tools and capabilities required, for example, for prototype demonstrations of HLED matrix arrays.  The MCNC Analytical Laboratory provides analytical and technical support for the microfabrication facility, as well as other MCNC R&D programs.  These capabilities put MCNC in a unique position for electronic materials and device research, microfabrication, and advanced packaging.  Specific capabilities are listed below:


Thin film deposition:

o       Ion beam and RF sputter deposition, E-beam evaporation, Electroplating

o       Spin coating of polymers and sol-gel solutions

o       PECVD and MOCVD of dielectrics and metals


o       I-line stepper (features ³ 0.5 mm), Contact/proximity aligners (features ³ 2 mm)


o       Wet chemical and reactive ion etching of oxides, nitrides, polymers, metals, and resists

Packaging – flip chip and wire bonding


Analytical facility:

    1.       Scanning Electron Microscopy (SEM)
    2.       Energy Dispersive Spectroscopy (EDX/EDS)
    3.       Transmission Electron Microscopy (TEM)
    4.       Atomic Force Microscopy (AFM)
    5.       Auger Electron Spectroscopy (AES)
    6.       X-ray Photoelectron Spectroscopy (XPS)
    7.       X-ray Fluorescence Spectroscopy (XRF)
    8.       Probe stations, parameter analyzers.

©2009  MBE Lab., North Carolina A&T State University, Greensboro, NC 27410